[Mobile China News] – There’s been a rising tide of information circled online about the Huawei P70 series. According to recent leaks from a blogger, the new range is set to be powered by a fresh chipset named Kirin 9010.
Tech blogger @SmartPikachu shared, “The new foldable from Huawei is still using the Kirin 9000S, but the P70 has already been tested with the Kirin 9010.” The upcoming Huawei P70 series is expected to feature this new chipset by HiSilicon, tentatively called “Kirin 9010.” While it hasn’t been officially unveiled, rumors of this chip have been brewing for some time.
The name Kirin 9010 first emerged three years ago—the word on the street was that it would be a 3nm process chip. TSMC was considered the most likely candidate to produce it, but current trade restrictions on Huawei make this prospect uncertain. Huawei reportedly registered the trademark for this name back in 2021 with plans to start production in 2022, which ultimately did not come to fruition.
In terms of performance, leaks suggest that the Kirin 9010 chip in the Huawei P70 scored on par with the Snapdragon 8 Gen2 in benchmarks. If this holds true, the performance of the Kirin 9000S could make Huawei devices in hot demand, potentially putting the Kirin 9010-equipped Huawei P70 series on a fast track to success.
Huawei P70 Series Render
Reports indicate that Huawei intends to reintroduce 5G connectivity into the P70 series. A render of the Huawei P70 series has been leaked, showcasing an innovative triangular camera module design that stands out in terms of aesthetics. The lineup is expected to include multiple variants such as the P70, P70 Pro, and P70 Art. Rumors suggest that an ultra-wide camera with a 1-inch sensor and a high-quality 1G6P lens (one glass element, six plastic elements) may feature on the P70 Art. In-house developed sensors are supposedly underway at Huawei—anticipated to debut with the P70 series, which is slated for a release around March.