MediaTek to Launch Dimensity 9400 in Q4, Rumored to be Built on TSMC’s 3nm Tech
Last year in November, the flagship chip MediaTek Dimensity 9300 was officially released. As time progresses, news about its iterative product, the Dimensity 9400, has started to emerge.
Recently, multiple reports have mentioned that the MediaTek Dimensity 9400 is set to be launched in the fourth quarter of this year.
According to reports, MediaTek CEO Cai Lixing has expressed confidence in MediaTek’s flagship chip Dimensity 9300 and the upcoming shift towards AI-driven smartphones. He revealed that MediaTek plans to introduce the Dimensity 9400 in the fourth quarter of this year, marking MediaTek’s first chip to be built on TSMC’s 3nm process. Compared to Dimensity 9300, significant improvements in performance and efficiency are expected.
The Dimensity 9400 is said to continue using Arm cores. Building upon the architecture of Dimensity 9300, the large core will be upgraded from Cortex-X4 to Cortex-X5. Additionally, it will still support LPDDR5T memory to meet the demands of on-device AI computing.
Moreover, the Dimensity 9400 is expected to support larger AI models to be run on devices, surpassing the 330 billion parameter large language model of Dimensity 9300.
It is reported that MediaTek announced its collaboration with TSMC to develop its first 3nm chip early in 2024. The efficiency is expected to increase by 32%, with mass production beginning in 2024.
According to data mentioned in MediaTek’s press release, compared to the N5 node, TSMC’s next-generation node (N3) can provide an 18% performance improvement at the same power level, reduce power consumption by 32% at the same frequency, and increase logic density by 60%.
Looking back, the previous-generation Dimensity 9300 utilized TSMC’s third-generation 4nm process, with a “full large core” CPU architecture. The CPU included 4 Cortex-X4 super large cores, with a maximum frequency of 3.25GHz, as well as 4 Cortex-A720 large cores with a frequency of 2.0GHz. It was the first to support LPDDR5T 9600Mbps memory.
With the support of a full large core CPU architecture, it displayed strong multi-threaded performance, further reducing power consumption and extending battery life, easily handling heavy usage scenarios such as gaming + live streaming or gaming + video playback.
Additionally, it integrated the MediaTek seventh-generation AI processor APU 790, supporting on-device operation of AI large language models with 1 billion, 7 billion, 13 billion, and up to 33 billion parameters. Through hardware compression technology NeuroPilot Compression, it significantly reduced the memory footprint of AI large models on the device, enabling smooth operation of generative AI on the edge.
The Dimensity 9300 also pioneered the use of the new flagship 12-core GPU Immortalis-G720, equipped with MediaTek’s second-generation hardware ray tracing engine, supporting high smoothness ray tracing at 60FPS, and bringing console-level global lighting effects to games.
Meanwhile, news about the next-generation Qualcomm Snapdragon 8 series flagship chip has also begun to surface.
According to the blogger @数码闲聊站 (Digital Chat Station), the Snapdragon 8 Gen4, codenamed “SUN,” will be built on TSMC’s 3nm process. The CPU will adopt a 2Phoenix L+6Phoenix M architecture, and the current CPU self-developed architecture design shows a significant performance improvement.
Taking into account the existing information, both the Dimensity 9400 and Snapdragon 8 Gen4 are planned to undergo significant performance upgrades. However, there is still a considerable amount of time before the release of these two chips, and more news is expected to emerge. Those interested should keep an eye out for further developments.
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