Recently, a significant announcement from MediaTek and Aliyun has caught widespread attention in the industry. It has been reported that MediaTek has successfully deployed the Tongyi Qianwen large model on its flagship chip, the Dimensity 9300, marking a new milestone in AI on mobile devices. This collaboration will have a profound impact on AI applications … Continue reading Aliyun & MediaTek Launch Mobile AI: Tongyi Qianwen on Dimensity 9300→
March 28, 2024 – MediaTek Announces Deep Collaboration with Alibaba Cloud MediaTek has announced a deep partnership with Alibaba Cloud, successfully deploying a compact version of the Tongyi Qianwen AI Model on their Dimensity 9300 mobile platform. This deployment also supports the Dimensity 8300 platform, enabling offline, real-time, and accurate multi-turn human-machine conversational interactions. The … Continue reading MediaTek & Alibaba Cloud Deploy AI Model on Dimensity Mobile Platform→
March 28, 2024 – MediaTek has announced an in-depth collaboration with Alibaba Cloud, achieving the milestone deployment of a smaller-scale model of Alibaba’s Tongyi Qianwen (aka “Comprehensive Thousand Questions” AI model) on MediaTek’s Dimensity 9300 mobile platform. This deployment is compatible with the Dimensity 8300 platform and facilitates instantaneous, accurate multi-turn human-machine dialogue in offline … Continue reading MediaTek & Alibaba Cloud Deploy AI Model on Tianji Platform→
Last year, in the second half, MediaTek launched the Dimensity 9300 processor targeting the flagship market. In terms of performance and power efficiency, it reached a considerably high level, comparable to the Snapdragon 8 Gen3 processor, and has been well received by many flagship smartphones. However, the Dimensity 9300 processor was not previously used in … Continue reading Vivo Pad 3 Debuts with Dimensity 9300 CPU→
AI Benchmark Releases Top AI Performance Rankings for Mobile Devices and Chips On January 18th, TechNews reported that AI Benchmark unveiled the rankings for AI performance on mobile devices and AI chips. The MediaTek Dimensity 9300 claimed the top spot on both the mobile device and chip rankings, establishing itself as the most powerful AI … Continue reading Top AI Phone: Dimensity 9300→
OPPO Find X7 Tops the January Android Flagship Phone Performance Rankings In the latest January Android flagship phone performance rankings released by AnTuTu, the OPPO Find X7 has clinched the top spot with its outstanding performance, showcasing its top-notch flagship capabilities. The title of “Flagship Chip King” carried by the MediaTek Dimensity 9300 chip it … Continue reading OPPO Find X7, Top Performer with Dimensity 9300→
According to the latest released AnTuTu performance rankings for Android flagship smartphones in January, the OPPO Find X7 featuring the Dimensity 9300 chip has shown outstanding performance in the flagship smartphone category, firmly securing the top spot with its powerful capabilities. This further solidified Dimensity 9300’s position as the “king of flagship chips.” At the … Continue reading MediaTek Dimensity 9300 tops AnTuTu!→
Rumors of MediaTek’s Tianji 9400 on TSMC’s 3nm Process Node Spark Massive Performance Upgrade Numerous rumors have surfaced claiming that the Tianji 9400 mobile platform and the fourth generation Snapdragon 8 mobile platform will be among the first to adopt the 3nm process node for flagship Android SoCs. Recently, the digital gossip blogger Station Chat … Continue reading TSMC’s 3nm Tech Powers New Chip→
[Pacific Tech News] Recently, MediaTek’s chairman, Ming Tsai, and CEO, Rick Tsai, attended the groundbreaking ceremony for the Hsinchu High-Speed Rail Office Building. During the ceremony, Rick Tsai expressed that AI smartphones are the future trend, and MediaTek is fully aware of this. They plan to release the Dimensity 9400 in the fourth quarter of … Continue reading MediaTek Dimensity 9400 to Outdo Snapdragon 8 Gen 4 with 3nm Tech→
The Reign of Dimensity in 2024! MediaTek Dimensity 9400 Leaked: Utilizing TSMC’s 2nd Gen 3nm Technology The renowned tech platform, Fast Technology (快科技), revealed on January 24th that MediaTek Dimensity 9400 will be crafted using TSMC’s second-generation 3nm process, marking MediaTek’s first 3nm smartphone chip. According to sources, TSMC’s first-generation 3nm process is N3B, initially … Continue reading 2024’s King MediaTek! Dimensity 9400 Leaked: TSMC’s 2nd Gen 3nm→
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