The Reign of Dimensity in 2024! MediaTek Dimensity 9400 Leaked: Utilizing TSMC’s 2nd Gen 3nm Technology

The renowned tech platform, Fast Technology (快科技), revealed on January 24th that MediaTek Dimensity 9400 will be crafted using TSMC’s second-generation 3nm process, marking MediaTek’s first 3nm smartphone chip.

According to sources, TSMC’s first-generation 3nm process is N3B, initially adopted by TSMC’s major client Apple. The A17 Pro and M3 series chips are examples of products using TSMC’s first-generation 3nm process.

TSMC’s second-generation 3nm process, known as N3E, is expected to have a wider application than N3B. Apart from the aforementioned MediaTek Dimensity 9400 chip, Qualcomm’s Snapdragon 8 Gen4 and A18 series chips will also adopt the N3E process.

Publicly available information indicates that TSMC’s N3E is an enhanced version of N3B, offering higher yield and lower costs, albeit with slightly lower performance than N3B.

Furthermore, Fast Technology also mentioned that the MediaTek Dimensity 9400 chip will utilize the latest standard CPU and GPU architecture from Arm, promising exceptional design performance.

Following tradition, the MediaTek Dimensity 9400 is slated for release in the latter half of this year, making it MediaTek’s most powerful smartphone chip of 2024, earning the title “The Reign of Dimensity.”