TSMC Reveals Cutting-Edge Semiconductor Technologies at North America Technology Forum Today, on April 25th, TSMC held the “2024 North America Technology Forum” in the United States, unveiling its latest process technology, advanced packaging technology, and 3D IC technology. During the forum, TSMC unveiled for the first time a process technology called TSMC A16 (1.6nm). According … Continue reading TSMC’s 1.6nm A16 Tech Revealed! Mass Production Begins in 2026 →
Intel’s Collaboration with TSMC Upgraded to 3nm Process On February 23, CNMO learned that Intel’s CEO, Pat Gelsinger, confirmed that their collaboration with TSMC has upgraded from the 5nm process to 3nm. He mentioned that the Arrow Lake and Lunar Lake computing chipsets (CPU tile) set to be launched in the fourth quarter of 2024 … Continue reading Intel CEO: 3nm Collaboration with TSMC →
Apple May Be the First Client to Use TSMC’s 2nm Chips According to industry insiders, Apple is poised to become the first company to adopt TSMC’s 2nm process chips. This news was initially reported by tech media, stating that Apple “is widely considered the first customer to use this technology.” TSMC plans to start production … Continue reading TSMC’s 2nm Chips Coming; Apple May Be First Client →
Apple to Lead with TSMC’s 2nm Chips Apple, the largest client of TSMC (Taiwan Semiconductor Manufacturing Company), has become the first customer for its 3nm manufacturing process. Apple has consistently occupied a major part of the production capacity in TSMC’s 7nm, 5nm, and now 3nm processes. Reports indicate that Apple has already reserved a significant … Continue reading Apple to Lead with TSMC’s 2nm Chips →
The global supply of AI chips from the major GPU manufacturer NVIDIA is currently insufficient, primarily due to the inadequate CoWoS advanced packaging capacity provided by their partner TSMC. Even with TSMC’s commitment to expansion, it is expected that the capacity increase will not be available until at least the end of the year, relieving … Continue reading NVIDIA, Intel Choose Advanced Package Providers; TSMC Key Partner →
[Pacific Tech News] Recently, MediaTek’s chairman, Ming Tsai, and CEO, Rick Tsai, attended the groundbreaking ceremony for the Hsinchu High-Speed Rail Office Building. During the ceremony, Rick Tsai expressed that AI smartphones are the future trend, and MediaTek is fully aware of this. They plan to release the Dimensity 9400 in the fourth quarter of … Continue reading MediaTek Dimensity 9400 to Outdo Snapdragon 8 Gen 4 with 3nm Tech →
Article by Yao Liwei, January 29, 2024 According to reports, Intel has been actively advancing its IDM 2.0 strategy in recent years. On one hand, the company is open to external foundry services, and on the other hand, it is seeking external foundry partners to operate more flexibly. The Meteor Lake project marks the beginning … Continue reading Intel Eyes TSMC’s 2nm Tech for 50%+ Boost →
The Reign of Dimensity in 2024! MediaTek Dimensity 9400 Leaked: Utilizing TSMC’s 2nd Gen 3nm Technology The renowned tech platform, Fast Technology (快科技), revealed on January 24th that MediaTek Dimensity 9400 will be crafted using TSMC’s second-generation 3nm process, marking MediaTek’s first 3nm smartphone chip. According to sources, TSMC’s first-generation 3nm process is N3B, initially … Continue reading 2024’s King MediaTek! Dimensity 9400 Leaked: TSMC’s 2nd Gen 3nm →
TSMC Plans to Build Advanced 1nm Chip Manufacturing Factory in Taiwan On January 22nd, it was reported by United Daily News in Taiwan that after thorough evaluation, TSMC has ultimately decided to locate its most advanced 1nm chip manufacturing plant in the Chiayi Science Park, with a total investment exceeding a trillion New Taiwan dollars … Continue reading TSMC on 1nm Factory Site Rumors: Open to All Possibilities →
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