The global supply of AI chips from the major GPU manufacturer NVIDIA is currently insufficient, primarily due to the inadequate CoWoS advanced packaging capacity provided by their partner TSMC. Even with TSMC’s commitment to expansion, it is expected that the capacity increase will not be available until at least the end of the year, relieving … Continue reading NVIDIA, Intel Choose Advanced Package Providers; TSMC Key Partner
Article by Yao Liwei, January 29, 2024 According to reports, Intel has been actively advancing its IDM 2.0 strategy in recent years. On one hand, the company is open to external foundry services, and on the other hand, it is seeking external foundry partners to operate more flexibly. The Meteor Lake project marks the beginning … Continue reading Intel Eyes TSMC’s 2nm Tech for 50%+ Boost
Introducing vivoS18: A Stellar Gaming Experience with Top-Notch Features The vivoS18 is equipped with the Snapdragon 7Gen3 processor, with a performance score exceeding 1 million. It comes pre-installed with the brand new OriginOS4 system, featuring innovative technologies such as Unfair Scheduler 2.0 and memory fusion. Whether it’s smooth animation transitions or seamlessly running multiple apps … Continue reading Vivo S18: Style, Camera, Stellar Gaming