Tag Archives: Advanced packaging

Innovation

Fu Sheng and Zhou Chat via Sora: Zhou, seems you’re shifting concepts

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Recently, Zhou Hongyi, the founder and chairman of 360, and Fu Sheng, the CEO of Cheetah Mobile, had differing views on the topic of whether “Sora can accelerate the arrival of AGI.” Previously, Zhou Hongyi had shared his perspective, suggesting that the emergence of Sora might shorten the time for AGI to be achieved from … Continue reading Fu Sheng and Zhou Chat via Sora: Zhou, seems you’re shifting concepts →

Innovation

NVIDIA, Intel Choose Advanced Package Providers; TSMC Key Partner

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The global supply of AI chips from the major GPU manufacturer NVIDIA is currently insufficient, primarily due to the inadequate CoWoS advanced packaging capacity provided by their partner TSMC. Even with TSMC’s commitment to expansion, it is expected that the capacity increase will not be available until at least the end of the year, relieving … Continue reading NVIDIA, Intel Choose Advanced Package Providers; TSMC Key Partner →