March 11, 2024 14:40:41 by Liwei Yao

According to the official Weibo account of Qualcomm, Qualcomm will hold a Snapdragon flagship new product launch event on March 18. This event is expected to unveil the highly anticipated Snapdragon 8s Gen 3 and Snapdragon 7+ Gen 3 mobile platforms. These two processors will be built using TSMC’s 4nm process technology, promising impressive performance.

The Snapdragon 8s Gen 3 is said to offer performance between the Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3, while the Snapdragon 7+ Gen 3 adopts the flagship architecture design of the Snapdragon 8 Gen 3. In terms of specifications, the Snapdragon 8S Gen 3 features a CPU architecture consisting of 1 3.01GHz X4 big core, 4 2.61GHz A720 middle cores, and 3 1.84GHz A520 small cores, paired with an Adreno 735 GPU; whereas the Snapdragon 7+ Gen 3’s CPU consists of 1 2.9GHz X4 big core, 4 2.6GHz A720 middle cores, and 3 1.9GHz A520 small cores, along with an Adreno 732 GPU running at frequencies of over 800MHz.

Not only do these two processors boast excellent performance, but they also bring significant improvements in power consumption and heat dissipation. It is expected that they will become the core driving force for mid-range flagship smartphones of various brands, providing consumers with a smoother and more stable user experience. Currently, several models from various brands are likely to be equipped with these two processors, including the realme GT Neo6 series, Xiaomi Civi 4, and OnePlus Ace 3V.