MediaTek Dimensity 9400 Rumored to Boost Performance with “BlackHawk” CPU Architecture On April 28th, renowned tech blogger @TechTalkLeisure revealed that MediaTek’s next-generation flagship processor, Dimensity 9400, will feature an ARM architecture codenamed “BlackHawk,” with a significant increase in instructions per cycle (IPC). @TechTalkLeisure also mentioned in the comment section that thanks to the BlackHawk Cortex-X5 … Continue reading Ready to push performance limits? MediaTek Dimensity 9400 unveiled: Boosted by X5 mega core. →
Intel Achieves Milestone with World’s First High Numerical Aperture Extreme Ultraviolet Lithography System Recently, Intel’s newly established chip fabrication business announced the successful assembly of the world’s first commercial High Numerical Aperture Extreme Ultraviolet (EUV) lithography scanner, marking a significant milestone in the chip manufacturing industry. The name might sound perplexing, but it’s touted as … Continue reading World’s Top EUV Lithography System by Intel →
China’s Semiconductor Production Surges by 40% in Q1, Consolidating its Dominance in the Market On April 22, according to the latest data released by the National Bureau of Statistics of China, the semiconductor production in the country skyrocketed by 40% in the first quarter, signaling the increasingly dominant position of mature process chips in the … Continue reading Q1 sees a 40% surge! China’s semiconductor output hits record high →
[Pacific Tech News] According to media reports, the globally renowned semiconductor manufacturer Intel revealed in its Gaudi 3 AI chip white paper that it is preparing to launch a special version of the Gaudi 3 chip in the Chinese market. The Chinese special edition Gaudi 3 will consist of two products, the HL-328 OAM compatible … Continue reading Intel to release special chips in China, performance drops 92% →
On April 11th, news reports indicate that after the commercial production of the 3nm process technology began on December 29, 2022, at TSMC, the focus of process technology research and production shifted towards more advanced nodes of 2nm and 1.4nm. With over a year of mass production of the 3nm process technology, there is anticipation … Continue reading TSMC’s 2nm Process in ’24, 1.4nm in ’27 →
On April 1st, it was reported that the semiconductor foundry giant UMC has secured a major order from Qorvo, a supplier of RF power amplifiers (PA) for Apple, with an estimated production volume of over tens of thousands of wafers. This marks UMC’s success in winning the contract to manufacture crucial chips for Apple once … Continue reading Qorvo Chip Mega Order Goes to TSMC →
Tranlink Secures Major Chip Order from Qorvo On April 1st, it was reported that TSMC, a leading semiconductor foundry, has received a significant order from Qorvo, a supplier of radio frequency power amplifiers (PAs) to Apple, with an estimated wafer quantity of over tens of thousands. Following its previous success in supplying Apple-related chips for … Continue reading Tranlink secures major chip order from Qorvo →
Tianjin University Team Successfully Creates World’s First Graphene Semiconductor On January 4th, a report from the official website of Tianjin University revealed a breakthrough by the team led by Marei at the International Research Center for Nanoparticles and Nanosystems. Their research overcame a long-standing technical challenge that has hindered the development of graphene electronics. By … Continue reading World’s 1st Graphene Chip by Tianjin U Team →
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